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Re-printed in partnership with ITM

Bridging Defects


A bridge is comprised of solder that spans across two conductors that should not be electrically connected thus causing an electrical short.

Process and design-related causes:

• Excessive volume of solder due to improper pad dimension

• Excessive volume of solder due to improper stencil aperture

• Improper application of solder mask

• Excessive slump of solder paste

Reflow-related causes:

• Improper reflow profile for solder paste. Check against manufacturer’s specifications.

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