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860 Pressure Curing Oven (PCO)

A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

  • PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
  • Heaters, heat exchangers and blowers are internal to the pressure vessel.
  • When the curing process is complete, the Pressure Curing Ovens automatically relieves its pressure to 1atm and cools.

Process Specification:

  • Process time: Generally 120 min or User’s spec
  • Operating temp: 60oC ~ 200oC
  • Maximum temp: 220oC
  • Operating pressure: 1 bar – 10 bar
  • Capacity: 24 Magazines (typical)
  • Cooling method: PCW (17oC – 23oC)
  • Cooling water pressure: 25 – 40 psi

Pressure Cure Applications:

  • Composite Forming for the printing industry
  • Die Attach Curing
  • Wafer Laminating
  • Thermal Compress Bonding
  • Underfill Curing
  • Via Filling
  • Film & Tape Bonding

pressure curing oven

860 Pressure Curing Oven (PCO) photo

System Air Flow

Vacuum Module Option

PCO System Chamber

Chamber Dimensions

PCO System Dimensions

Chamber with shelves extended

Learn More

Representative Pressure/Temp Profiles (User Configurable)

Representative Pressure/Temp Profiles

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