Flux-Free Formic Reflow

Flux-Free Formic Reflow in Formic Acid Vapor

Heller has designed and built an production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).

• Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow
• Excellent results demonstrated for wafer bumping application in horizontal reflow oven
• Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents
• Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps
• No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution
• Feasibility has been demonstrated with production grade oven
• Extensive engineering efforts in safe, precision delivery of formic acid and abatement

Flux-Free Formic Reflow Advantages

• Can use any reflow profile (e.g., tent or soak profile) with formic acid
• Can adjust formic acid profile in oven in conjunction with thermal reflow profile
• Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards
• Includes Formic acid abatement systems for Green Process Solution
• Includes real time formic acid concentration monitor system

Formic Demo Machine Inside Class 10K Clean Room Florham Park, NJ.