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Re-printed in partnership with ITM

Opensor Insufficient Solder

Defect: opensor insufficient solder

The solder joint is incomplete resulting in an open circuit or a weak interconnection.

Process and design-related causes:

• Non-coplanar leads on the component

• Excessive warpage of the PCB or substrate

• Poor wetting

• Insufficient amount of solder due to improper printing parameters

• Skips in the printed solder due to blocked stencil aperture

• Misaligned solder print

• Improper stencil thickness

• Inadequate stencil aperture size

• Excessive pad size

• Via in pad draining solder from interconnection

Reflow-related causes:

• Preheat too aggressive

• Peak reflow (liquidus) temperature not being attained

• Malfunctioning oven which is impeding attenuation of proper temperatures

please fill out the contact form below with details and our staff will contact about a custom solution.

We know you hate sales guys & you don't have a lot of time. We can do a consult over Webex and let you ask questions without having to listen to a sales pitch.

We welcome you to visit any of our facilities - USA, Asia, Europe to get a closer look at our products and have all of your questions answered.

4 Vreeland Road,
Florham Park, NJ 07932, USA





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