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    1-973-377-6800

 
Re-printed in partnership with ITM

Delamination

Delamination is a separation between any of the layers of the base material or between the laminate and the conductive foil, or both.

Process and design-related causes:

• Improper fabrication of the PCB

• Improper packaging of PCBs during shipping

• Improper storage of PCBs resulting in excessive absorbed moisture. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels. Shipping and storing suspect plastic molded components in nitrogen is preferred.)

Reflow-related causes:

• Preheat portion of profile and rate of heating too aggressive (should not exceed 4K/sec.)


please fill out the contact form below with details and our staff will contact about a custom solution.


We know you hate sales guys & you don't have a lot of time. We can do a consult over Webex and let you ask questions without having to listen to a sales pitch.

We welcome you to visit any of our facilities - USA, Asia, Europe to get a closer look at our products and have all of your questions answered.

4 Vreeland Road,
Florham Park, NJ 07932, USA

+1-973-377-6800

+1-973-377-3862

Email

help@hellerindustries.com

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