• Phone

    1-973-377-6800

 
Re-printed in partnership with ITM

Voids

Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies.

Process and design-related causes:

• Improper solder volume due to improper land design

• Improper solder volume due to blocked stencil aperture

• Improper solder volume due to improper stencil design

• Paste viscosity too low

• Paste metal content too low

• Bad or expired solder paste

• Ambient humidity too high for solder paste work envelope

Reflow-related causes:

• Preheat too aggressive for flux – adjust to manufacturer’s recommendations

• Improper profile for solder paste


please fill out the contact form below with details and our staff will contact about a custom solution.


We know you hate sales guys & you don't have a lot of time. We can do a consult over Webex and let you ask questions without having to listen to a sales pitch.

We welcome you to visit any of our facilities - USA, Asia, Europe to get a closer look at our products and have all of your questions answered.

4 Vreeland Road,
Florham Park, NJ 07932, USA

+1-973-377-6800

+1-973-377-3862

Email

help@hellerindustries.com

Heller offices span the globe to facilitate the needs of our customers. Find representative

Find replacement parts for Heller reflow equipment

Newsletter

Join our mailing list to get future updates on new technologies!