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Dewetting is a condition that results when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film and the base metal is not exposed.

Process and design-related causes:

• Solder paste flux not aggressive enough for level of oxidation present on part or PCB

• PCB pad contaminated

• Component lead contaminated

• Excessive moisture absorbed by paste

• Paste exposed beyond worklife

• Ambient humidity and temperature beyond paste work envelope

• A palladium lead finish which requires higher reflow (liquidus) temperature

Reflow-related causes:

• Peak reflow (liquidus) temperature not being attained

• Malfunctioning oven which is impeding attenuation of proper temperatures

please fill out the contact form below with details and our staff will contact about a custom solution.

We know you hate sales guys & you don't have a lot of time. We can do a consult over Webex and let you ask questions without having to listen to a sales pitch.

We welcome you to visit any of our facilities - USA, Asia, Europe to get a closer look at our products and have all of your questions answered.

4 Vreeland Road,
Florham Park, NJ 07932, USA





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Find replacement parts for Heller reflow equipment


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